RFID Chip Assembling Machine Model: ST-FC180

General Descriptions

RFID Chip Assembling Machine Model: ST-FC180
Full auto RFID chip bonding machine is used for HF、UHF chip bonding, substrate web width(CD direction) up to 200MM, machine is integrated the antenna unwind, glue dispense, die attach, hot press, QC verification, bad inlay dot, etc functions, 8 and 12 inch of wafer disk is compatible, 6 inch of wafer disk need to customized made.

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Product Detail

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Introduction

1.This specialized equipment is designed for the roll-to-roll production of RFID inlays and chip bonding. It is ideally suited for the single-row flip-chip bonding of products featuring opaque or semi-transparent antennas (such as paper-based or opaque PET antennas).
2.Utilizing a sophisticated vision recognition system, the machine precisely identifies and locates minute chips—supplied in trays—as well as flexible antennas; subsequently, high-speed, high-precision actuators execute the accurate bonding of the chips to the antennas.

Features

Suitable for PET, paper antenna;
Substrate material Width：30~200mm,thickness: ≥50μm, die attach position of antenna is in the center ;
Wafer disk dimension: 8&12 inch,
Wafer size: 0.35*0.3mm to 3*3mm during this range;
Thickness of wafer: 0.075-0.16mm;
Glue: ACP is acceptable , NCP: not validated yet;
Pitch limit in X & Y axis: minimum 15mm, maximum 240mm ( remark: the pitch must be an integer multiple between 157 and 240mm)

Technical Specification

#	Parameter	Value
1	Dimension	L6000W1300H1750 (mm)
2	Weight	Around 2000 KG
3	Rated Voltage	Three phase, AC380V
4	Rated Power	Around 16 KW
5	Air Pressure	0.6 ~ 0.8 MPa
6	Air Consumption	About 100 L/MIN
7	Operator No.	1 person
8	Control Type	PC
9	Operation System	Win 10
10	UPH	Pitch 25mm: 15000 pcs/h
		Pitch 50mm: 7500 ~ 8000 pcs/h
		Pitch 150mm: 2600 pcs/h
11	Yield	99.70%
12	Noise	≤85 DB
13	Die Attach Accuracy	±0.05 mm
14	Application Material	Single up dry inlay
15	Substrate	PET, paper; thickness: ≥0.05 mm
16	Change Over Time — Full Product Change (antenna and chip and possibly ACP/NCP)	Around 150 minutes
17	Change Over Time — Wafer/Chip Only	5 minutes