• RFID

IOT eSIM chip Module for iPhone, Tablet, Watch, Car


Product Detail

Product Tags

product Introduct

As the next generation of cutting-edge technologies converge and the intelligent interconnection of things accelerates, secure, reliable, flexible, and efficient global connectivity has become crucial for industry transformation.

The TMC series eSIM solutions feature high security, high performance, high reliability, and one-stop service. They have been successfully adopted by numerous well-known equipment manufacturers and are widely used in mobile communications terminals, wearable devices, automotive electronics, IoT terminals, providing solid connectivity support for the intelligent transformation of numerous industries.

eSIM Solution Advantages

1.The security chip offers a storage capacity of 512KB to 2MB and has passed international CC EAL6+, UnionPay chip security certification, National Security Level 2, and AEC-Q100 certifications, providing world-class hardware security protection.
2.The operating system (OS) complies with GSMA SGP.22 V2.5 and domestic communication standards, covers over 400 operators worldwide, supports up to 10 profile downloads, provides customized eIDs, and offers online updates for the eSIM COS, enabling more flexible full-lifecycle management at the software level.
3.In terms of production safety, we are the first domestic company to achieve GSMA SAS-UP certification for wafer-level personalized security chips. We support both wafer-level and packaged personalization, ensuring secure and controllable operations throughout the entire wafer-to-package process.

4.In terms of LPA compatibility, we offer LPA reference implementations based on multiple operating systems, including Android, Linux, and RTOS, significantly simplifying terminal device integration and helping customers quickly seize market opportunities.

eSIM technology architecture

Consumer electronics  (2)

eSIM product specifications

1)Specifications of overseas products

POS, CPE, watches

THD89-E512
TMC-E92-1 XXB

package:
WLCSP 1.5*1.8
DFN8 5*6
capacity:512k
Level: consumer grade, industrial grade

2)Mobile phones, laptops, POS

THD89-E512
TMC-E92-1 XXB

package:
WLCSP 1.5*1.8
DFN8 5*6
capacity:512k
Level: consumer grade, industrial grade

3)Mobile phones, watches, POS

THD89-E1500
TMC-E92-5 XXB

package:
WLCSP 2.0*2.5 P IN
33G 2.5*2.7
capacity:1.5M
Level: Consumer

4)AR glasses, PAD, mobile phone, watch, POS

  • THD89-E1280

TMC-E92-3 XXA

package:

WLCSP 1.8*2.0
PIN 33G 2.5*2.7
DFN8 3*3 DFN8 5*6
capacity:1.25M
Level: consumer grade, automotive grade

  • THD89-E2048
    TMC-E92-4 XX

package: WLCSP 2.0*2.5
PIN 33G 2.5*2.7
capacity:2M
Level: Consumer


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